- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/44 - Arrangements for cooling, heating, ventilating or temperature compensation the complete device being wholly immersed in a fluid other than air
Patent holdings for IPC class H01L 23/44
Total number of patents in this class: 178
10-year publication summary
|
11
|
10
|
25
|
21
|
14
|
21
|
11
|
19
|
19
|
14
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Fujitsu Limited | 19265 |
9 |
| Intel Corporation | 45621 |
7 |
| Northrop Grumman Systems Corporation | 2940 |
7 |
| Infineon Technologies AG | 8189 |
6 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
6 |
| Mitsubishi Heavy Industries, Ltd. | 8217 |
5 |
| International Business Machines Corporation | 60644 |
4 |
| Micron Technology, Inc. | 24960 |
4 |
| Microsoft Technology Licensing, LLC | 51439 |
4 |
| OVH | 272 |
4 |
| ExaScaler Inc. | 35 |
4 |
| YASA Limited | 58 |
4 |
| Modine LLC | 46 |
4 |
| NEC Corporation | 32703 |
3 |
| Oracle International Corporation | 12313 |
3 |
| Semiconductor Components Industries, L.L.C. | 5345 |
3 |
| Hamilton Sundstrand Corporation | 4525 |
3 |
| Panasonic Corporation | 20786 |
2 |
| Murata Manufacturing Co., Ltd. | 22355 |
2 |
| Seagate Technology LLC | 4228 |
2 |
| Other owners | 92 |